Min Thickness (Inner Layer Residue Copper 0.5oz, Resdiue Copper Rate 65%) |
4L |
6L |
8L |
10L |
12L |
14L |
16 mils |
24 mils |
32 mils |
40 mils |
48 mils |
56 mils |
|
Min/Max Layer Count |
Min 2 Layer, Max 22 Layer |
Min Inner Layer Thickness |
4 mils |
Min Trace / Space |
4/4 mils Protype 3/3 mils Copper (Thickness 1/ 3oz) |
Min Finished Hole Size |
8 mils (Aspect Ratio 5) |
Drilling Accuracy |
±3 mil |
Lamination Evenness |
±3 mil |
Min Channel of SMD Pitch |
10 mil |
Min Channel of SMD Pitch |
8 mil |
Min DAM Between Fine Pitch |
4 mil |
Min Space of Soldermask |
4 mil |
Layer To Layer Registration Tollence |
±3 mil |
±3 mil |
±3 mil |
±3 mil |
±3 mil |
±3 mil |
|
Impedance Control Tollance |
100 ±10%, 50±10% |
Board Bow / Twist Tolerance |
< 0.75% |
Min Length (V-Cut) |
2 inch |
Max Width (V-Cut) |
29 inch |
Min Width (V-Cut) |
2 inch |
Min Board Thickness (V-Cut) |
12 mils |
Golden Finger Max Width Beveling |
70 mils |
Max Working Size |
29 x 22.44 inch |
